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DOI RECORD

Epoxy composites with 3D thermally conductive networks toward thermal-management-related applications

Yuchen Zhang, Hongwei He iD, Haojing Guo, Wenwen Yu, Huayun Du

DOI10.1557/s43578-026-01992-6

PublisherSpringer Science and Business Media LLC

Journal / SourceJournal of Materials Research

Published2026-09-30

Metadata Deposited2026-09-30 (updated: 2026-09-30)

Subject—

Languageen

ISSN0884-2914, 2044-5326

Typejournal-article

Volume / Issue / Pages— / — / —

Citations0

References deposited33

Access / license metadataAccess not determined License 1 ↗A reuse license does not by itself establish whether the full text is freely readable.